Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

Edition :	1.0
File Size :	1 file , 3.2 MB
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	187
Published :	05/07/2014

IEC/TR 62866 Ed. 1.0 b:2014 PDF

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

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